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HERSTELLUNG DURCHKONTAKTIERTER LEITERPLATTEN FUER DEN ENTWICKLUNGSBEDARF. = FABRICATION DE CIRCUITS IMPRIMES A TROUS METALLISES POUR REPONDRE A L'ACCROISSEMENT DE LA DEMANDESCHUTT J.1977; FEINGERAETETECHNIK; DTSCH.; DA. 1977; VOL. 26; NO 12; PP. 541-544; ABS. ANGL. FR.; BIBL. 5 REF.Article

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PLATING.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 6-17 (8P.)Article

REDUCING WATER AND CHEMICAL CONSUMPTION IN PC ELECTROPLATINGBEYER GH.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 29-31Article

VAPOR PHASE REFLOW SOLDERING OF BACKPLANES AND MOTHER BOARDS WITH WIRE-WRAPPED PINS AND CONNECTORS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 1; PP. 48-49Article

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RELIABILITY OF COPPER-PLATED-THROUGH-HOLE PRINTED WIRING BOARD.KOBUNA H; SATO T; NOGUSHI S et al.1976; N.E.C. RES. DEVELOP.; JAP.; DA. 1976; NO 41; PP. 38-49; BIBL. 12 REF.Article

IMPURITIES IN SOLDER: HOW THEY INFLUENCE SOLDERABILITY AND STRENGTH OF PCB PLATED THROUGH-HOLESBECKER G.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 49-52Article

THE TOPSIDE PTH SOLDER FILLETGADZINSKI E.1979; CIRCUITS MANUF.; USA; DA. 1979; VOL. 19; NO 11; PP. 68-116; (2 P.)Article

MEASURING PCB PLATING THICKNESSBUSH G.1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 3; PP. 76-82; (4 P.)Article

FLUXLESS FUSION OF TIN-LEAD PLATED PRINTED CIRCUIT BOARDS VIA VAPOR PHASE PROCESS1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 5; PP. 19-20Article

MEASURING COPPER THICKNESS IN PLATED THREE HOLES.RITTER J; BUSH G.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 5; PP. 34-35Article

NEW TEST METHOD MEASURES SOLDERABILITY OF PLATED-THROUGH HOLES.BECKER G.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 13; PP. 73-78; BIBL. 3 REF.Article

0.35 μm rule device pattern fabrication using high absorption-type novolac photoresist in single layer deep ultraviolet lithography : surface image transfer for contact hole fabricationTOMO, Y; KASUGA, T; SAITO, M et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1992, Vol 10, Num 6, pp 2576-2580, issn 1071-1023Conference Paper

An approximation algorithm for the via placement problemGONZALEZ, T. F; SHASHISHEKHAR KURKI-GOWDARA.IEEE transactions on computer-aided design of integrated circuits and systems. 1989, Vol 8, Num 3, pp 219-228, issn 0278-0070, 10 p.Article

What to do about pinholes in plated through hole connectionsTURNER, R. L.Electri.onics. 1985, Vol 31, Num 4, pp 53-55, issn 0745-4309Article

Automated inspection of plated through-holes for printed circuit boardsHARA, Y; DOI, H; NUMATA, K et al.International journal of the Japan Society for Precision Engineering. 1994, Vol 28, Num 4, pp 362-367, issn 0916-782XArticle

Desoldering components from high-density PCB'sBAUSELL, J.Electri.onics. 1984, Vol 30, Num 8, pp 25-27, issn 0745-4309Article

Surface mounting and fine line boards. IIMANKO, H. H.Electri.onics. 1984, Vol 30, Num 11, pp 15-19, issn 0745-4309Article